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GLZ6.8

General Semiconductor
Part Number GLZ6.8
Manufacturer General Semiconductor
Title Zener Diodes
Description New Product GLZ Series Zener Diodes VZ Range 3.3 to 39V Power Dissipation 500mW MiniMELF (SOD-80C) Cathode Mark 0.142 (3.6) 0.134 (3.4) ∅ 0.0...
Features
• Silicon Planar Zener Diodes
• In MiniMELF case especially for automatic insertion
• The Zener voltages are graded according to voltage bands instead of by tolerance.
• Low Zener impedance and low leakage current
• Popular in Asian designs Maximum Ratings and Thermal Characteristics (TA = 25°C unl...

Published Jul 1, 2018
Datasheet PDF File GLZ6.8 File

GLZ6.8   GLZ6.8   GLZ6.8  




GLZ6.8

UPM
Part Number GLZ6.8
Manufacturer UPM
Title SURFACE MOUNT ZENER DIODES
Description UPM GLZ2.0~GLZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipat.
Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI-MELF Termina.

Datasheet PDF File GLZ6.8 File

GLZ6.8   GLZ6.8   GLZ6.8  




GLZ6.8

EIC discrete Semiconductors
Part Number GLZ6.8
Manufacturer EIC discrete Semiconductors
Title ZENER DIODES
Description www..com GLZ Series VZ : 3.3 to 39V PD : 500mW FEATURES : • Silicon Planar Zener Diodes • In MiniMELF case especially for automatic in.
Features :
• Silicon Planar Zener Diodes
• In MiniMELF case especially for automatic insertion
• The Zener voltages are graded according to voltage bands instead of by tolerance.
• Low Zener impedance and low leakage current
• Pb / RoHS Free ZENER DIODES MiniMELF (SOD-80C) Cathode Mark φ 0.063 (1.64) 0.055.

Datasheet PDF File GLZ6.8 File

GLZ6.8   GLZ6.8   GLZ6.8  




GLZ6.8

KD
Part Number GLZ6.8
Manufacturer KD
Title 500mW SUFACE MOUNT ZENER DIODE
Description GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembl.
Features
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method .

Datasheet PDF File GLZ6.8 File

GLZ6.8   GLZ6.8   GLZ6.8  






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