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GLZ56

WON-TOP
Part Number GLZ56
Manufacturer WON-TOP
Title 500mW SURFACE MOUNT ZENER DIODE
Description ® WON-TOP ELECTRONICS Features  Planar Die Construction  500mW Power Dissipation  2.0 – 56V Nominal Zener Voltage  Ideally Suited for Automate...
Features
 Planar Die Construction
 500mW Power Dissipation
 2.0
  – 56V Nominal Zener Voltage
 Ideally Suited for Automated Assembly
 For Use in Voltage Stabilizer or Reference Mechanical Data
 Case: MiniMELF, Molded Glass
 Terminals: Plated Leads Solderable per MIL-STD-202, Method 208
 Polarity: Catho...

Published Jul 1, 2018
Datasheet PDF File GLZ56 File

GLZ56   GLZ56   GLZ56  




GLZ56

PAN JIT
Part Number GLZ56
Manufacturer PAN JIT
Title SURFACE MOUNT ZENER DIODES
Description GLZ2.0 SERIES SURFACE MOUNT ZENER DIODES VOLTAGE 2.0 to 56 Volt POWER 500 mWatt FEATURES • Planar Die construction • 500mW Power Dissipation •.
Features
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2011/65/EU directive MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.001 ounces, 0.03 .

Datasheet PDF File GLZ56 File

GLZ56   GLZ56   GLZ56  




GLZ56

KD
Part Number GLZ56
Manufacturer KD
Title 500mW SUFACE MOUNT ZENER DIODE
Description GLZ2.0 ~ GLZ56 500mW SUFACE MOUNT ZENER DIODE FEATURES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembl.
Features
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method .

Datasheet PDF File GLZ56 File

GLZ56   GLZ56   GLZ56  




GLZ56

Rectron
Part Number GLZ56
Manufacturer Rectron
Title SURFACE MOUNT ZENER DIODES
Description SURFACE MOUNT ZENER DIODES VOLTAGE RANGE 2.0 to 56 Volts 500mWatts GLZ SERIES FEATURES • Planar Die construction • 500mW Power Dissipation • Ide.
Features
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.001 ounces, 0.03 grams.
• M.

Datasheet PDF File GLZ56 File

GLZ56   GLZ56   GLZ56  




GLZ56

UPM
Part Number GLZ56
Manufacturer UPM
Title SURFACE MOUNT ZENER DIODES
Description UPM GLZ2.0~GLZ56 SURFACE MOUNT ZENER DIODES Voltage Range 2.0-56 Volts Power 500mWatts Features * Planar Die construction * 500mW Power Dissipat.
Features * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI-MELF Termina.

Datasheet PDF File GLZ56 File

GLZ56   GLZ56   GLZ56  






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