X006 Datasheet PDF - STMicroelectronics

www.Datasheet-PDF.com

X006
STMicroelectronics

Part Number X006
Description 0.8A SCRs
Page 10 Pages


X006 datasheet pdf
Download PDF
X006 pdf
View PDF for Mobile

No Preview Available !

X006 Series
0.8A SCRs
SENSITIVE
Main features
Symbol
www.DataSheet4U.com
IT(RMS)
VDRM/VRRM
IGT
Value
0.8
600
60 to 200
Unit
A
V
µA
Description
Thanks to highly sensitive triggering levels, the
X006 SCR series is suitable for all applications
where the available gate current is limited, such
as ground fault circuit interrupters, overvoltage
crowbar protection in low power supplies,
capacitive ignition circuits, ...
Available in though-hole or surface-mount
packages, these devices are optimized in forward
voltage drop and inrush current capabilities, for
reduced power losses and high reliability in harsh
environments.
A
G
K
KGA
TO-92
(X006xxA)
Order codes
Part Numbers
X00602MA 1AA2
X00602MA 2AL2
X00602MA 5AL2
X00602MN5BA4
X00605MA 1AA2
A
AG
K
SOT-223
(X006xxN)
Marking
X0602 MA
X0602 MA
X0602 MA
X06 2M
X0605 MA
August 2006
Rev 4
1/10
www.st.com



No Preview Available !

Characteristics
1 Characteristics
X006 Series
Table 1.
Symbol
Absolute ratings (limiting values)
Parameter
Value
Unit
IT(RMS) RMS on-state current (180° conduction angle)
IT(AV) Average on-state current (180° conduction angle)
www.DataSheet4U.com
ITSM Non repetitive surge peak on-state current
I²t I²t Value for fusing
dI/dt
IGM
PG(AV)
Tstg
Tj
Critical rate of rise of on-state current
IG = 2 x IGT , tr 100 ns
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
TO-92
Tl = 85° C
SOT-223 Ttab = 100° C
TO-92
Tl = 85° C
SOT-223 Ttab = 100° C
tp = 8.3 ms
Tj = 25° C
tp = 10 ms
tp = 10 ms Tj = 25° C
0.8
0.5
10
9
0.4
A
A
A
A2S
F = 60 Hz Tj = 125° C
50 A/µs
tp = 20 µs
Tj = 125° C
Tj = 125° C
1
0.1
- 40 to + 150
- 40 to + 125
A
W
°C
Table 2.
Symbol
Electrical characteristics
Test Conditions
X00602 X00605 Unit
IGT
VGT
VGD
VRG
IH
IL
dV/dt
VTM
Vt0
Rd
IDRM
IRRM
VD = 12 V RL = 140
VD = VDRM RL = 3.3 kRGK = 1 k
IRG = 10 µA
IT = 50 mA RGK = 1 k
IG = 1 mA
RGK = 1 k
VD = 67% VDRM RGK = 1 k
ITM = 1 A tp = 380 µs
Threshold voltage
Dynamic resistance
VDRM = VRRM RGK = 1 k
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
MIN.
MAX.
MAX.
MIN.
MIN.
MAX.
MAX.
MIN.
MAX.
MAX.
MAX.
MAX.
MAX.
15 30
200 60
0.8
0.2
5
5
6
25
1.35
0.85
245
1
100
µA
V
V
V
mA
mA
V/µs
V
V
m
µA
2/10



No Preview Available !

X006 Series
Characteristics
Table 3.
Symbol
Thermal resistances
Rth(j-a) Junction to ambient (D.C.)
Rth(j-l)
Rth(j-t)
Junction to lead (D.C.)
Junction to tab (DC)
Parameter
S = 5 cm2
TO-92
SOT-223
TO-92
SOT-223
Value
150
60
70
30
Unit
°C/W
Figure 1.
www.DataSheet4U.com
Maximum average power
Figure 2.
dissipation versus average on-state
current
Average and D.C. on-state current
versus case temperature (TO-92)
P(W)
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0.0
0.1
IT(AV)(A)
0.2 0.3
0.4
360°
α
0.5 0.6
IT(AV)(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
D.C.
α = 180°
TO-92
Tl(°C)
50 75
100 125
Figure 3.
Average and D.C. on-state current Figure 4.
versus ambient temperature (epoxy
printed circuit board FR4, copper
thickness eCU=35 µm, SCU= 0.5
cm2) (TO-92)
Average and D.C. on-state current
versus casetemperature (SOT-223)
IT(AV)(A)
1.0
0.9
D.C.
0.8
0.7
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0
25
Tamb(°C)
50 75
TO-92
SCU = 0.5 cm2
100 125
IT(AV)(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
D.C.
α = 180°
SOT-223
Ttab(°C)
50 75
100 125
3/10



No Preview Available !

Characteristics
X006 Series
Figure 5.
Average and D.C. on-state current Figure 6.
versus ambient temperature (epoxy
printed circuit board FR4, copper
thickness eCU=35 µm, SCU=5 cm2)
(SOT-223)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
cSiCrcUu=i0t.5bocamrd2)F(RTO4,-9e2C)U=35 µm,
IT(AV)(A)
1.0
0.9
D.C.
0.8
SOT-223
SCU = 0.5 cm2
Zth(j-a)/Rth(j-a)
1.00
TO-92
SCU = 0.5 cm2
0.7
0.6
0.5
www.DataSheet4U.com
0.4
α = 180°
0.10
0.3
0.2
0.1
0.0
0
Tamb(°C)
tp(s)
0.01
25 50 75 100 125
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
cSiCrcUu=i0t.5bocamrd2)F(RSO4,Te-2C2U3=)35 µm,
Zth(j-a)/Rth(j-a)
1.00
SOT-223
SCU = 0.5 cm2
0.10
0.01
1.E-03
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
1.E+03
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under tab (printed circuit board
FR4, eCU=35 µm) (SOT-223)
Rth(j-a)(°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10 S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 9.
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1.6
1.4
1.2
1.0
IH & IL
0.8
0.6 IGT
0.4
0.2
Tj(°C)
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Figure 10. Relative variation of holding
current versus gate-cathode
resistance (typical values)
IH[RGK] / IH[RGK=1k]
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.E-02
1.E-01
RGK(k)
1.E+00
1.E+01
1.E+02
4/10



X006 datasheet pdf
Download PDF
X006 pdf
View PDF for Mobile


Related : Start with X00 Part Numbers by
X006 0.8A SCRs X006
STMicroelectronics
X006 pdf
X00602MA 0.8A SCRs X00602MA
STMicroelectronics
X00602MA pdf
X00602MA Thyristor SCR 600V 10A 3-Pin TO-92 X00602MA
New Jersey Semiconductor
X00602MA pdf
X00602MA1AA2 0.8A SCRs X00602MA1AA2
STMicroelectronics
X00602MA1AA2 pdf
X00602MA2AL2 0.8A SCRs X00602MA2AL2
STMicroelectronics
X00602MA2AL2 pdf
X00602MA5AL2 0.8A SCRs X00602MA5AL2
STMicroelectronics
X00602MA5AL2 pdf
X00619 0.8 A sensitive gate SCR X00619
ST Microelectronics
X00619 pdf

Index :   0   1   2   3   4   5   6   7   8   9   A   B   C   D   E   F   G   H   I   J   K   L   M   N   O   P   Q   R   S   T   U   V   W   X   Y   Z   

This is a individually operated, non profit site. If this site is good enough to show, please introduce this site to others.
Since 2010   ::   HOME   ::   Contact