STMP3410 Datasheet PDF - SigmaTel

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STMP3410
SigmaTel

Part Number STMP3410
Description (STMP3501 - STMP3560) Audio System on Chip With Hi-speed Usb
Page 30 Pages


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Integrated Mixed-Signal Solutions
PRODUCT DATA SHEET
STMP35xx
D-Major™Audio System on Chip
with USB 2.0, LCD, Voice Record and Battery Charger
Third Generation Audio Decoder
Version 1.07 November 9, 2004
90
94
FM Tuner
98 102 106
Host Processor
(Optional)
Rechargeable
Battery
Hi-Speed USB
LED/LCD Screen
SDRAM
Microphone
Voice Record
Flash Memory
Hard Drive
Buttons/Switches CD Pickup
Headphones
OFFICIAL PRODUCT DOCUMENTATION 12/1/04
5-35xx-D1-1.07-110904
Copyright © 2004 SigmaTel, Inc.
All rights reserved.
SigmaTel, Inc. makes no warranty for the use of its products, assumes no responsibility for any errors which may appear in this document,
and makes no commitment to update the information contained herein. SigmaTel reserves the right to change or discontinue this product at
any time, without notice. There are no express or implied licenses granted hereunder to design or fabricate any integrated circuits based on
information in this document.
The following are trademarks of SigmaTel, Inc., and may be used to identify SigmaTel products only: SigmaTel, the SigmaTel Logo, C Major,
D Major and Go-Chip. Other products and company names contained herein may be trademarks of their respective owners.



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OFFICIAL PRODUCT DOCUMENTATION 12/1/04
STMP35xx
D-Major™Audio System on Chip
1. TABLE OF CONTENTS
1. TABLE OF CONTENTS ..................................................................................................................... 2
2. PRODUCT OVERVIEW ..................................................................................................................... 3
3. CHARACTERISTICS/SPECIFICATIONS ........................................................................................ 21
4. DSP CORE ....................................................................................................................................... 25
5. ON-CHIP MEMORY SUBSYSTEM .................................................................................................. 30
6. CHIP WIDE PROGRAMMABLE CONTROL REGISTERS ............................................................. 38
7. INTERRUPT SUBSYSTEM .............................................................................................................. 49
8. USB CONTROLLER ........................................................................................................................ 60
9. INTEGRATED USB 2.0 PHY (HS,FS) ............................................................................................. 79
10. PARALLEL EXTERNAL MEMORY CONTROLLER (EMC) ....................................................... 103
11. GENERAL PURPOSE FLASH CONTROLLER .......................................................................... 118
12. FLASH ECC ACCELERATOR .................................................................................................... 134
13. FILTER COPROCESSOR (FILCO) ............................................................................................. 154
14. PULSE WIDTH MODULATOR (PWM) CONTROLLER .............................................................. 185
15. I2C INTERFACE ........................................................................................................................... 196
16. ENHANCED SPI INTERFACE ..................................................................................................... 209
17. SPI INTERFACE .......................................................................................................................... 217
18. TIMERS ........................................................................................................................................ 220
19. SDRAM INTERFACE ................................................................................................................... 227
20. SWIZZLE ...................................................................................................................................... 239
21. REAL-TIME CLOCK/ALARM/WATCHDOG RESET & PERSISTENT BITS .............................. 247
22. I2S SERIAL AUDIO INTERFACE ................................................................................................ 258
23. GENERAL PURPOSE INPUT/OUTPUT (GPIO) ......................................................................... 265
24. DAC .............................................................................................................................................. 276
25. ADC .............................................................................................................................................. 286
26. MIXER .......................................................................................................................................... 297
27. HEADPHONE DRIVER ................................................................................................................ 310
28. LOW RESOLUTION ADC ............................................................................................................ 315
29. BOOT MODES ............................................................................................................................. 329
30. DC-DC CONVERTER .................................................................................................................. 339
31. PIN DESCRIPTION ..................................................................................................................... 377
32. PACKAGE DRAWINGS ............................................................................................................... 389
33. STMP35XX FAMILY MEMBER PART NUMBERS & ORDERING INFORMATION ................... 391
34. INDEX OF REGISTERS ............................................................................................................... 393
ADDITIONAL SUPPORT
Additional product and company information can be obtained by going to the Sigma-
Tel website at:www.sigmatel.com. Additional product and design information is
available for authorized customers at: extranet.sigmatel.com
2 5-35xx-D1-1.07-110904



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OFFICIAL PRODUCT DOCUMENTATION 12/1/04
STMP35xx
D-Major™Audio System on Chip
2. PRODUCT OVERVIEW
2.1. Features
• Decodes MP3 and WMA and is upgradeable to other digital music formats
• Supports WMA Digital Rights Management (DRM) and other security schemes
• Includes on-chip read only unique ID for digital rights management algorithms
• USB High Speed Device Interface (up to 480Mb/s transfers)
• Enables file transfer and firmware upgrade using USB Mass Storage Class
• Both Windows and Macintosh drivers available
• Integrated USB High Speed PHY
• Direct connection to USB 5V power for operation and battery charging
• 96K Words (288K Bytes) of on-chip RAM
• Hardware support for flexible external storage options
• NAND Flash, MMC, Secure Digital, SmartMedia, CompactFlash
• Five byte address support for new 1Gb/die (128KB block) NAND Flash
• MLC NAND Flash support
• 1.8V NAND Interface Support
• 16 bit wide NAND support
• Hardware accelerated ECC off-loads DSP bit error correction
• SDRAM
• ATA/IDE Hard Disk digital devices.
• Optimized for very long battery life
• 50 hours of operation on a single AA battery
• Flexible, efficient on-chip DC-DC converter
• Flexible battery configurations, including 1xAA, 1xAAA, 2xAA, 2xAAA, LiIon
• Pulse frequency modulation mode for low standby power
• Energy saving dynamic power management
• Typical off current is 250µA (crystal oscillator & real time clock only)
• More than 1 year battery life in “off” mode on one AA Alkaline battery
• Integrated battery charger for LiIon and NiMH
• Battery temperature sensor support for safest charging protocols
• Real time clock with alarm function wakes up from powerdown/standby modes
• High quality integrated audio mixed signal sub-system
• <0.05% THD direct drive headphone amplifier
– Eliminates DC blocking capacitors
– Including anti-pop and short-circuit protection
• High performance 18-bit Σ∆ technology stereo D/A and A/D converters
• Full analog mixer configuration
• Line-in to Headphone/Line-out SNR >90 dB
• Two analog line-level inputs: Line1 In (stereo), Line2 In (stereo, 144-pin package)
• Mic(mono) input with integrated pre-amp and microphone biasing circuit
• Volume control
• GPIO, button I/O controls, and LCD/LED Display Compatible Interface
• Pulse Width Modulators for EL backlights
• Integrated 75MHz DSP with Filter Coprocessor for power optimization
• Optimized for audio applications
• Field upgradeable firmware
5-35xx-D1-1.07-110904
3



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OFFICIAL PRODUCT DOCUMENTATION 12/1/04
STMP35xx
D-Major™Audio System on Chip
2.2.
• Integrated Development Environment, SDK, and debugger
• Application and support libraries
• Bass and Treble control; configurable multiple band EQ control
• Voice record in ADPCM format (upgradable to other formats)
• FM tuner input and control support
• Optional interface to a host chip/processor for cell phone & PDA applications, etc.
• Application notes, reference schematics, sample PCB layouts are available.
• Offered in 100-pin TQFP, and 144-pin fpBGA packages
• Backward pin and firmware compatible with STMP3410
STMP35xx Block Diagram
Hard D rive
LED/LCD
Buttons/
Switches
E.L. Backlight
MM C /S D
Card
I2C
P eriph erals
S m artMed ia
C o mp actFlash
NOR Flash
NAND Flash
MLC Flash
SDRAM
IDCEDInCtoenrftarcoel
In terface
I2S & CD
S ynchI2rSonCizDatio n
S ynIcnhterrofnacizeatio n
GIP2CIOInIntteerrffaaccee
PSuPlIsIentWerifdatche
SSPPIIIInntteerrffaaccee
II22CC IInntteerrffaaccee
Fla sh/ID E
In tEerMfaCce
SSDDRRAAMM
IInntteerrffaaccee
90
94
98 102 106
USB High Speed
USB Full Speed
FM Radio
M icro ph one
USB PHY
(H SU&SBF S )
USB 2.0
DUevSicBe
InItnetrerrurputpCt Conotnrtorlo, lT, iTmimeresr,sB, it
ManBipituMlaatinoinpuUlnatitio, RnTUCn,itT,race
DebuTgraUcneitD, Rebeuegd-USnoiltomon
Memory Bus
Peripheral Bus
Filter &
EUCSCB
eng ines
ADmACp
24-bit
DDSSPP
D ACC
ADDCC
ST M P35xx
Σ Headphones
C ap -less
Direct Drive
OOnn--CChhiipp RROOMM
186K x 24bits
OOnn--CChhiipp RRAAMM
9966KK xx 2244bbiittss
Te mpe rature
Low
R esDoCluDtCio n
CAoDnCvexr3ter
B aLtotewry
CRheasrogleurti
on ADC
DDCCDDCC
CCoonnvveerrtteerr
RTC,
ALPALRLM,
PxLtaLl,
XTAL
Rechargable B attery
5V
Input
Crystal
Figure 1. Chip Block Diagram
Pin 1
14 mm
14 mm
Pin A1
10 mm
10 mm
100-pin TQFP
144-pin fpBGA
For additional package measurements, please see 32. “PACKAGE DRAWINGS” on page 389.
Figure 2. Chip Package Photos
4 5-35xx-D1-1.07-110904



STMP3410 datasheet pdf
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