Q22FA238xxxxx00 Datasheet PDF - Epson Electronics

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Q22FA238xxxxx00
Epson Electronics

Part Number Q22FA238xxxxx00
Description Thin SMD High-frequency Crystal
Page 1 Pages


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THIN SMD HIGH-FREQUENCY CRYSTAL UNIT
FA-238
Product number (please refer to page 1)
Q2 2 FA 2 3 8 x x x x x 0 0
• High-density mounting-type SMD.
• Excellent shock resistance.
• Capable of covering a wide frequency range. (from 16 MHz to 50 MHz)
• 0.7 mm Max. thickness is equal to SMD-type IC.
• Most suitable for small communication devices.
Crystal unit
Actual size
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Specifications (characteristics)
Item Symbol
Nominal frequency range
f
Temperature
range
Storage temperature
Operating temperature
Operable temperature
TSTG
TOPR
TUSE
Drive level
Maximum drive level
Recommended drive level
GL
DL
Frequency tolerance
f/f
Specifications
16.000 MHz to 50.000 MHz
-40 °C to +125 °C
-40 °C to +85 °C
As per below table
2 mW Max.
10 µW to 100 µW
±50 x 10-6(standard)
(±15 x 10-6 to ±50 x 10-6 is available)
Remarks
Fundamental mode
1
Stored as bare product after unpacking
Specified equivalent series must be satisfied.
Specified equivalent series and frequency temperature characteristics must be satisfied.
Only crystal oscillation is guaranteed
Ta=+25 °C±3 °C
For the out of standard specifications,
please contact us for inquiries. 1
Frequency temperature characteristics
±30 x 10-6(standard)
As per below table
-20 °C to +70 °C
For the out of standard specifications,
please contact us for inquiries. 1
Load capacitance
Series resistance
Shunt capacitance
Insulation resistance
Aging
CL
R1
C0
IR
fa
7 pF to (standard:12 pF)
As per below table
5.0 pF Max.
500 M Min.
±5 x 10-6/year Max.
Please specify
Operable temperature range , DL=100 µW
Ta=+25 °C ±3 °C, first year
Shock resistance
S. R.
1 f > 40 MHz : Only standard specifications
Frequency temperature characteristics
±10 x 10-6 Max.
100 g dummy (Seiko Epson Standard) drop from 1500 mm height
on to the concrete 3 directions 10 times.
Series resistance (R1)
Operable temperature
Frequency tolerance
Frequency
Series resistance
0 °C to +50 °C
± 8 × 10-6 Min.
16.0 MHz f < 20.0 MHz
80 Max.
-10 °C to +60 °C
± 12 × 10-6 Min.
20.0 MHz f < 25.0 MHz
60 Max.
-20 °C to +70 °C
± 15 × 10-6 Min.
25.0 MHz f < 30.0 MHz
50 Max.
-30 °C to +80 °C
± 20 × 10-6 Min.
30.0 MHz f 50.0 MHz
40 Max.
-40 °C to +85 °C
± 30 × 10-6 Min.
External dimensions
#4 #3
2000M
E66RA
#1 #2
3.2
(Unit: mm) Recommended soldering pattern (Unit: mm)
1.2
#3
#4
2.2
#2
0.7 Max.
#4
0.9
Internal connection
#1
#3
1.4
#1
#2
#2 and #4 is connected with a cover.
24



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