MR27V6452G Datasheet PDF - OKI electronic

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MR27V6452G
OKI electronic

Part Number MR27V6452G
Description 4M-Word x 16-Bit or 8M-Word 8-Bit P2ROM
Page 9 Pages


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OKI Semiconductor
MR27V6452G
P2ROM4M–Word × 16–Bit or 8M–Word × 8–Bit Page Mode
FEDR27V6452G-02-06
Issue Date: Jul. 9, 2004
FEATURES
· 4,194,304-word × 16-bit / 8,388,608-word × 8-bit electrically
switchable configuration
· Page size of 8-word x 16-Bit or 16-word x 8-Bit
· 3.0 V to 3.6 V power supply
·Random Access time 100 ns MAX
·Page Access time
30 ns MAX
· Operating current
50 mA MAX (5MHz)
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27V6452G-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
·MR27V6452G-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
· Short lead time, since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
· No additional programming charge, unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
· Custom Marking is available at no additional charge.
· Pin Compatible with Mask ROM and some FLASH
products.
PIN CONFIGURATION (TOP VIEW)
A21 1
A18 2
A17 3
A7 4
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
CE# 12
VSS 13
OE# 14
D0 15
D8 16
D1 17
D9 18
D2 19
D10 20
D3 21
D11 22
44SOP
44 A20
43 A19
42 A8
41 A9
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE#
32 VSS
31 D15/A–1
30 D7
29 D14
28 D6
27 D13
26 D5
25 D12
24 D4
23 VCC
A15 1
A14 2
A13 3
A12 4
A11 5
A10 6
A9 7
A8 8
A19 9
A20 10
NC 11
NC 12
A21 13
NC 14
NC 15
A18 16
A17 17
A7 18
A6 19
A5 20
A4 21
A3 22
A2 23
A1 24
48 A16
47 BYTE#
46 VSS
45 D15/A–1
44 D7
43 D14
42 D6
41 D13
40 D5
39 D12
38 D4
37 VCC
36 D11
35 D3
34 D10
33 D2
32 D9
31 D1
30 D8
29 D0
28 OE#
27 VSS
26 CE#
25 A0
48TSOP(Type-I)
1/9
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OKI Semiconductor
FEDR27V6452G-02-06
MR27V6452G / P2ROM
BLOCK DIAGRAM
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A–1
× 8/× 16 Switch
CE#
OE#
BYTE#
CE OE
Memory Cell Matrix
4M × 16-Bit or 8M × 8-Bit
Multiplexer
Output Buffer
D0 D2 D4 D6 D8 D10 D12 D14
D1 D3 D5 D7 D9 D11 D13 D15
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
D15 / A–1
A0 to A21
D0 to D14
CE#
OE#
BYTE#
VCC
VSS
NC
Functions
Data output / Address input
Address inputs
Data outputs
Chip enable input
Output enable input
Word / Byte select input
Power supply voltage
Ground
No connect
2/9
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OKI Semiconductor
FEDR27V6452G-02-06
MR27V6452G / P2ROM
FUNCTION TABLE
Mode
Read (16-Bit)
Read (8-Bit)
Output disable
CE#
L
L
L
Standby
H
OE#
L
L
H
: Don’t Care (H or L)
BYTE#
H
L
H
L
H
L
VCC
3.3 V
D0 to D7
DOUT
D8 to D14
DOUT
Hi–Z
Hi–Z
Hi–Z
D15/A–1
L/H
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Output short circuit current
Symbol
Ta
Tstg
VI
VO
VCC
PD
IOS
Condition
relative to VSS
Ta = 25°C
Value
0 to 70
–55 to 125
–0.5 to VCC+0.5
–0.5 to VCC+0.5
–0.5 to 5
1.0
10
Unit
°C
°C
V
V
V
W
mA
RECOMMENDED OPERATING CONDITIONS
Parameter
VCC power supply voltage
Input “H” level
Input “L” level
Symbol
VCC
VIH
VIL
Condition
VCC = 3.0 to 3.6 V
Min.
3.0
2.2
–0.5∗∗
Voltage is relative to VSS.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
Typ.
(Ta = 0 to 70°C)
Max.
Unit
3.6 V
VCC+0.5
0.6
V
V
PIN CAPACITANCE
Parameter
Input
BYTE#
Output
Symbol
CIN1
CIN2
COUT
Condition
VI = 0 V
VO = 0 V
(VCC = 3.3 V, Ta = 25°C, f = 1 MHz)
Min. Typ. Max. Unit
——
8
— — 200 pF
— — 10
3/9
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OKI Semiconductor
FEDR27V6452G-02-06
MR27V6452G / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
Input leakage current
Output leakage current
VCC power supply current
(Standby)
VCC power supply current
(Read)
Input “H” level
Input “L” level
Output “H” level
Output “L” level
Symbol
ILI
ILO
ICCSC
ICCST
ICCA
VIH
VIL
VOH
VOL
Condition
VI = 0 to VCC
VO = 0 to VCC
CE# = VCC
CE# = VIH
CE# = VIL, OE# = VIH
f=5MHz
IOH = –2 mA
IOL = 4 mA
(VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C)
Min. Typ. Max. Unit
— — 10 µA
— — 10 µA
— — 10 µA
— — 1 mA
— — 50 mA
2.2
–0.5∗∗
2.4
— VCC+0.5
— 0.6
——
— 0.4
V
V
V
V
Voltage is relative to VSS.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
Parameter
Address cycle time
Address access time
Page cycle time
Page access time
CE# access time
OE# access time
Output disable time
Output hold time
Symbol
tC
tACC
tPC
tPAC
tCE
tOE
tCHZ
tOHZ
tOH
Condition
CE# = OE# = VIL
OE# = VIL
CE# = VIL
OE# = VIL
CE# = VIL
CE# = OE# = VIL
Measurement conditions
Input signal level --------------------------------------0 V/3.0 V
Input timing reference level-------------------------1/2Vcc
Output load ---------------------------------------------50 pF
Output timing reference level ----------------------1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
(VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C)
Min.
Max.
Unit
100 — ns
— 100 ns
30 — ns
— 30 ns
— 100 ns
— 25 ns
0 20 ns
0 20 ns
0 — ns
4/9
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