MPXC12DT1 Datasheet PDF - Freescale Semiconductor

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MPXC12DT1
Freescale Semiconductor

Part Number MPXC12DT1
Description 10 kPa Uncompensated Silicon Pressure Sensor
Page 5 Pages


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Freescale Semiconductor
Pressure
MPXC12DT1
Rev 0, 11/2010
10 kPa Uncompensated Silicon
Pressure Sensor
MPXC12DT1
Freescale Semiconductor has developed a low cost, high volume, miniature
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer.This
standard, low cost, uncompensated sensor permits manufacturers to design
and add their own external temperature compensating and signal conditioning
networks. Compensation techniques are simplified because of Freescale’s
single element strain gauge design.
Features
• Low Cost
• Ratiometric to Supply Voltage
• Polysulfone Case Material (ISO 10993)
• Provided in Easy-to-Use Tape and Reel
• Patented Silicon Shear Stress Strain Gauge Design
Pressure Sensor
55 mV Full Scale Span (Typical)
0 to 10 kPa
Application Examples
• Respiratory Diagnostics
Device Name
MPXC12DTI
Package Options
Tape and Reel
ORDERING INFORMATION
Case No.
Gauge
Pressure Type
Differential
423A
Absolute
Device Marking
Date Code, Lot ID
CHIP PAK PACKAGE
MPXC12DT1
CASE 423A
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).
Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices
during all processes.
© Freescale Semiconductor, Inc., 2010. All rights reserved.



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Pressure
Freescale Semiconductor's Bio-compatible Pressure
Sensors have been designed for medical usage by
combining the performance of Freescale Semiconductor's
shear stress pressure sensor design and the use of
biomedically approved materials. Materials with a proven
history in medical situations have been chosen to provide a
sensor that can be used with confidence in applications, such
as invasive blood pressure monitoring. It can be sterilized
using ethylene oxide. The portions of the pressure sensor
that are required to be biomedically approved are the rigid
housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: 10993-5:1999, 10993-10:2002, and 10993-
11:1993.
These sensors contain a silicone dielectric gel which
covers the silicon piezoresistive sensing element. The gel is
a nontoxic, nonallergenic elastomer system which meets all
USP XX Biological Testing Class V requirements. The
properties of the gel allow it to transmit pressure uniformly to
the diaphragm surface, while isolating the internal electrical
connections from the corrosive effects of fluids, such as
saline solution. The gel provides electrical isolation sufficient
to withstand defibrillation testing, as specified in the proposed
Association for the Advancement of Medical Instrumentation
(AAMI) Standard for blood pressure transducers. A
biomedically approved opaque filler in the gel prevents bright
operating room lights from affecting the performance of the
sensor.
The MPXC12DT1 is a no-gel option.
MPXC12DT1
2
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MAXIMUM RATINGS
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Maximum Pressure (Backside)
Storage Temperature
Operating Temperature
Pmax
Tstg
TA
75
-25 to +85
+15 to +40
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Pressure
Unit
kPa
°C
°C
OPERATING CHARACTERISTICS
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max Unit
Pressure Range(1)
POP
0
— 10 kPa
Supply Voltage(2)
VS — 3 10 Vdc
Supply Current
Io — 6.0 — mAdc
Full Scale Span(3)
VFSS
45
65
80 mV
Offset(4)
Sensitivity
Voff 0
20 35 mV
ΔV/ΔP
6.5
— mV/kPa
Linearity
Pressure Hysteresis (0 to 10 kPa)
Temperature Hysteresis (+15°C to +40°C)
Input Impedance
Output Impedance
— 0 — 10 %VFSS
— — ±0.1 — %VFSS
— — ±0.1 — %VFSS
Zin 400 — 550 Ω
Zout 750
— 1250
Ω
Response Time(5) (10% to 90%)
tR — 1.0 — ms
Warm-Up(6)
Offset Stability(7)
— — 20 v ms
— — ±0.5 — %VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Sensors
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MPXC12DT1
3



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Pressure
F
AA
AD
PACKAGE DIMENSIONS
A
M
1 23 4
N
V
D1
G
FRONT VIEW
DETAIL A
AC
AB
BACK VIEW
D2
DETAIL A
CASE 423A-03
ISSUE C
CHIP PAK PACKAGE
C
LF
B
K
–T–
J
H
E
END VIEW
NOTES:
31.. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
42.. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.240 0.260
B 0.350 0.370
C 0.140 0.150
D1 0.012 0.020
D2 0.014 0.022
E 0.088 0.102
F 0.123 0.128
G 0.045 0.055
H 0.037 0.047
J 0.007 0.011
K 0.120 0.140
L 0.095 0.105
M 0.165 0.175
N 0.223 0.239
V 0.105 0.115
AA 0.095 0.107
AB 0.015 0.035
AC 0.120 0.175
AD 0.100 0.115
MILLIMETERS
MIN MAX
6.10 6.60
8.89 9.40
3.56 3.81
0.30 0.51
0.36 0.56
2.24 2.59
3.12 3.25
1.14 1.40
0.94 1.19
0.18 0.28
3.05 3.56
2.41 2.67
4.19 4.45
5.66 6.07
2.67 2.92
2.41 2.72
0.38 0.89
3.05 4.45
2.54 2.92
STYSLTEYL2E: 1:
PINPI1N.
2.
12GS.. +NV+ODCUCT
3.3V. s–OUT
4.4S. -GROUND
MPXC12DT1
4
Sensors
Freescale Semiconductor



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