1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F
DRAWING WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
5. DIMENSION L IS MEASURED FROM END OF
DIM MIN MAX
A 1.60 1.80
B 1.15 1.35
C 0.80 1.00
D 0.25 0.40
E 0.15 REF
H 0.00 0.10
J 0.089 0.177
K 2.30 2.70
PIN 1. CATHODE
ǒ ǓSCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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