MC72000 Datasheet PDF - Freescale Semiconductor


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MC72000
Freescale Semiconductor

Part Number MC72000
Description Integrated Bluetooth Radio
Page 30 Pages

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Advance Information
Data Sheet
MC72000/D
Rev. 2.6, 1/2003
MC72000 Integrated
Bluetooth™ Radio
Freescale Semiconductor, Inc.
MC72000
Package Information
Plastic Package
Case 1398-01
(MAPBGA–100)
.comDevice
MC72000
Ordering Information
Operating
Temperature Range
-40° C to 85° C
Package
MAPBGA – 100
eet4UContents
1 MC72000 Features . . . . 2
h2 System Overview . . . . . . 3
3 Electrical
SCharacteristics. . . . . . . . 4
4 Package Pinout . . . . . . 17
5 System Description . . . 27
ta6 Radio Functional
Description . . . . . . . . . . 31
7 Hardware Functional
aDescription. . . . . . . . . . 49
8 Bluetooth Baseband
Functionality
.DOverview. . . . . . . . . . . 126
9 HCI Features. . . . . . . . 134
10 Applications
Information . . . . . . . . . 139
w11 Application Example
Evaluation Printed Circuit
Boards . . . . . . . . . . . . 150
w12 Mechanical Outline
(Package
mInformation) . . . . . . . . 151
w oAppendix A: Radio
eet4U.cRegister Map . . . . . . . 152
The MC72000 Integrated Bluetooth™ Radio provides a complete, low-power Bluetooth
radio solution. The design is based on Motorola’s third-generation Bluetooth architecture
that has set a high standard for interoperability, complete functionality, and compliance with
the Bluetooth specification.
The MC72000 Integrated Bluetooth Radio from Motorola implements the RF and baseband
host controller interface (HCI) of the Bluetooth protocol in a small 7 mm x 7 mm BGA
package. The MC72000 is the ideal solution for low-power, short-range Bluetooth
applications with small size constraints and includes superior performance features like a
dedicated Bluetooth audio processor module and on-chip memory. Debug and production
test are fully supported through the joint test action group (JTAG) interface.
The RF portion of the radio provides a unique combination of high sensitivity, excellent C/I
performance, and low power consumption. These performance parameters are extremely
important to maintaining a robust link in high RF interference environments created by
devices such as mobile phones, high density Bluetooth networks, 802.11b networks, and
microwave ovens.
The MC72000 uses an innovative, highly advanced packaging technique to combine two
die—the RF and baseband functions—into a single, cost-effective package. Motorola’s
optimized two-chip architecture avoids compromises between cost and performance that
other one-chip solutions must make. With Motorola’s integrated solution, customers get the
best of both. Each die is implemented in its optimal process technology to deliver low cost,
low power, and small size.
w.DataShThis document contains information on a new product. Specifications and information herein are subject to change
without notice. © Motorola, Inc., 2003. All rights reserved.
wwPreliminary
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MC72000 Features
Freescale Semiconductor, Inc.
1 MC72000 Features
Radio Transceiver
• Low Current Drain
• Power Down Modes for Power Conservation
• Low IF Receiver with On-Chip Filters
• Fully Integrated Demodulator with ADC
• Direct Launch Transmitter
• Multi-Accumulator, Dual-Port, Fractional-N Synthesizer
• RSSI with ADC
• Bluetooth Class 2 Radio (Class 1 supported using external PA)
• Crystal Independent (12 to 15 MHz) Reference Oscillator or 12 to 26 MHz if supplied externally
• Power Supply Range: 2.5 V to 3.1 V
Baseband Controller
• Bluetooth Specification 1.1 Compliant
— Point-to-multipoint with 7 slaves
— All connection types
— All packet types
— All power saving modes
— Master/Slave switch
— Encryption
— HCI UART transport layer
• Outstanding Audio Performance
— Sample rate synchronization between CODECs and Bluetooth clock domains to avoid clicking
effects
— 3 Simultaneous SCO channels supported
— All Bluetooth encoding/decoding schemes supported (CVSD, A-Law, µ-Law)
— Very low audio delay to avoid the need for echo cancellation
• Support for 8, 16, 32, and 64 kHz Sample Rate CODECs
• Bluetooth Link Controller
• Bluetooth Audio Signal Processor
• ARM7 Processor Complex
• Peripherals
— High-speed UART (up to 2 Mbps)
— High-speed SSI (up to 2 Mbps)
— High-speed SPI (up to 2 Mbps)
• Embedded Memory
— SRAM (64 K)
— ROM (256 K)
2
MC72000 Advance Information Data Sheet
MOTOROLA
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Freescale Semiconductor, Inc.
• JTAG Test Interface Controller
• 32.768 kHz Oscillator for Low Power Operation
• Operating Voltage: 1.65 V to 1.95 V
System Overview
2 System Overview
This section provides a brief description of the system for the MC72000.
A system overview is shown in Figure 1
Antenna
RF Signal Path
Bandpass
Filter
Rx/Tx
Switch
Tx
Rx
32.768 KHz
XTAL
12-15 MHz
XTAL
MC72000
SSI Interface
UART Interface
GPIO
reset
SPI
SEEPROM
Application Software
Configuration Data
Figure 1. MC72000 Example Application Block Diagram
The main block is the MC72000, which will be described in depth in Section 5, “System Description.”
In addition to the MC72000, there are three other blocks:
• RF signal Path
• Interfaces
• Reference clocks
2.1 RF Signal Path
The switch for the RX and TX, the bandpass filter, and the antenna are all found in the RF signal path.
2.2 Interfaces
There are four bi-directional interfaces and one reset that only the host can initiate.
• The SSI interface is used for audio purposes.
• The UART interface is used for all communication to and from the host (for example, HCI
commands).
• The SPI is used for communication with the SEEPROM.
• The GPIO pins are used for different configurations set by the MC72000.
2.3 Clocks/Crystals
The MC72000 has two clocks:
MOTOROLA
MC72000 Advance Information Data Sheet
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Electrical Characteristics Freescale Semiconductor, Inc.
• The reference clock (12-26 MHz) is used when the MC72000 is active. Note that for a crystal
connected to the on-chip oscillator, the frequency range is 12-15 MHz as shown in Figure 1.
• The low power clock (32.768 kHz) is also included and may have high initial tolerance.
3 Electrical Characteristics
The absolute maximum ratings given in Table 1 are stress ratings only, and functional operation at the
maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent
damage to the device.
WARNING:
This device contains protective circuitry to guard against damage due to
high static voltage or electrical fields. However, normal precautions are
advised to avoid application of any voltages higher than maximum rated
voltages to the high-impedance circuit. Reliability of operation is
enhanced if unused inputs are tied to an appropriate logic voltage level (for
example, either VDD or GND), except for JTAG signals. Refer to
Section 10.12, “JTAG Interface,” for details on how to handle JTAG
signals.
3.1 Electrical Characteristics
The following tables provide information on the electrical characteristics of the MC72000.
Table 1. Absolute Maximum Ratings
Characteristics
Symbol
Value
Unit
Power Supply Voltage, RF
Power Supply Voltage, BB
Power Supply Voltage, IO
Junction Temperature
Storage Temperature Range
(GND – 0.3) to 3.2
VDC
(GND – 0.3) to 2.0
VDC
(GND – 0.3) to 3.6
VDC
TJ 150 ºC
Tstg
-55 to 150
ºC
Table 2. ESD Protection Characteristics
Characteristics
Symbol
Min
Typ
Human Body Model (HBM)
All pins, except RFIN, PAO+, and PAO-
RFIN, PAO+, and PAO-
Machine Model (MM)
All pins, except RFIN, PAO+, and PAO-
RFIN, PAO+, and PAO-
VHBM
VRFHBM
VMM
VRFMM
2000
100
200
50
-
-
-
-
Max Unit
V
-
-
V
-
-
4
MC72000 Advance Information Data Sheet
MOTOROLA
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