K10P104M100SF2 Datasheet PDF - Freescale Semiconductor

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K10P104M100SF2
Freescale Semiconductor

Part Number K10P104M100SF2
Description K10 Sub-Family
Page 30 Pages


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Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K10P104M100SF2
Rev. 1, 11/2010
K10 Sub-Family Data Sheet
Supports the following:
MK10N512VLL100, MK10N512VML100
Features
Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– Hardware random-number generator
– 128-bit unique identification (ID) number per chip
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K10P104M100SF2
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
Communication interfaces
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
Preliminary



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Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................19
1.1 Determining valid orderable parts......................................4
6.1.1 Debug trace timing specifications.........................19
2 Part identification......................................................................4
6.1.2 JTAG electricals....................................................20
2.1 Description.........................................................................4
6.2 System modules................................................................23
2.2 Format...............................................................................4
6.3 Clock modules...................................................................23
2.3 Fields.................................................................................4
6.3.1 MCG Specifications...............................................23
2.4 Example............................................................................5
6.3.2 Oscillator Electrical Characteristics.......................25
3 Terminology and guidelines......................................................5
6.3.2.1 Oscillator DC Electrical Specifications 25
3.1 Definition: Operating requirement......................................5
6.3.2.2 Oscillator frequency specifications......26
3.2 Definition: Operating behavior...........................................6
6.3.3 32kHz Oscillator Electrical Characteristics............27
3.3 Definition: Attribute............................................................6
6.3.3.1 32kHz Oscillator DC Electrical
3.4 Definition: Rating...............................................................7
Specifications......................................27
3.5 Result of exceeding a rating..............................................7
6.3.3.2 32kHz Oscillator Frequency
3.6 Relationship between ratings and operating
Specifications......................................27
requirements......................................................................7
6.4 Memories and memory interfaces.....................................28
3.7 Guidelines for ratings and operating requirements............8
6.4.1 Flash (FTFL) Electrical Characteristics.................28
3.8 Definition: Typical value.....................................................8
6.4.1.1 Flash Timing Parameters — Program
3.9 Typical Value Conditions...................................................9
and Erase............................................28
4 Ratings......................................................................................9
6.4.1.2 Flash Timing Parameters —
4.1 Thermal handling ratings...................................................9
Commands..........................................28
4.2 Moisture handling ratings..................................................10
6.4.1.3 Flash (FTFL) Current and Power
4.3 ESD handling ratings.........................................................10
Parameters..........................................29
4.4 Voltage and current operating ratings...............................10
6.4.1.4 Reliability Characteristics....................29
5 General.....................................................................................11
6.4.2 EzPort Switching Specifications............................29
5.1 Nonswitching electrical specifications...............................11
6.4.3 Flexbus Switching Specifications..........................30
5.1.1 Voltage and Current Operating Requirements......11
6.5 Security and integrity modules..........................................32
5.1.2 LVD and POR operating requirements.................12
6.6 Analog...............................................................................32
5.1.3 Voltage and current operating behaviors..............13
6.6.1 ADC electrical specifications.................................32
5.1.4 Power mode transition operating behaviors..........13
6.6.1.1 16-bit ADC operating conditions..........33
5.1.5 Power consumption operating behaviors..............14
6.6.1.2 16-bit ADC electrical characteristics....35
5.1.5.1 Diagram: Typical IDD_RUN operating
6.6.1.3 16-bit ADC with PGA operating
behavior...............................................16
conditions............................................38
5.1.6 EMC radiated emissions operating behaviors.......17
6.6.1.4 16-bit ADC with PGA characteristics...39
5.1.7 Designing with radiated emissions in mind...........18
6.6.2 CMP and 6-bit DAC electrical specifications.........40
5.1.8 Capacitance attributes..........................................18
www.Da5t.a2ShSeweitt4chUin.cgoemlectrical specifications.....................................18
6.6.3 12-bit DAC electrical characteristics.....................41
6.6.3.1 12-bit DAC operating requirements.....41
5.3 Thermal specifications.......................................................18
6.6.3.2 12-bit DAC operating behaviors..........42
5.3.1 Thermal operating requirements...........................18
6.6.4 Voltage Reference Electrical Specifications..........44
5.3.2 Thermal attributes.................................................19
6.7 Timers................................................................................45
6 Peripheral operating requirements and behaviors....................19
6.8 Communication interfaces.................................................45
K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
2
Preliminary
Freescale Semiconductor, Inc.



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6.8.1 DSPI Switching Specifications for Low-speed
Operation..............................................................46
6.8.2 DSPI Switching Specifications (High-speed
mode)....................................................................47
6.8.3 SDHC Specifications.............................................49
6.8.4 I2S Switching Specifications.................................50
6.9 Human-machine interfaces (HMI)......................................52
6.9.1 General Switching Specifications..........................52
6.9.2 TSI Electrical Specifications..................................52
7 Dimensions...............................................................................53
7.1 Obtaining package dimensions.........................................53
8 Pinout........................................................................................54
8.1 K10 Signal Multiplexing and Pin Assignments..................54
8.2 K10 Pinouts.......................................................................57
9 Revision History........................................................................58
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K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
3



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Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to www.freescale.com and perform a part number search for
the following device numbers: PK10 and MK10.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
Description
Qualification status
www.DKa#ta#Sheet4U.com Kinetis family
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K10
M Flash memory type
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K10 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
4
Preliminary
Freescale Semiconductor, Inc.



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