F. Peel off the LCM protective film slowly.
The module is attached with a film to protect the display surface from contamination, damage,
adhesion of flux, etc. Peeling off this film abruptly could cause static electricity to be generated,
so peel the tape slowly.
G. Pay attention to the humidity in the work area.
50~60% RH is recommended.
3.3 Precautions for the soldering of a LCM
The following procedures should be followed when soldering the LCM:
A. Solder only to the I/O terminal.
B. Use a no leakage soldering iron and pay particular attention to the following:
(1) Conditions for soldering I/O terminals
Temperature at iron tip: 280
Soldering time: 3~4 sec/terminal
Type of solder: Eutectic solder (rosin flux filled)
Note: (Avoid using flux, because it could penetrate the module and the module may get
contaminated during cleaning.) Peel off protective film after soldering the I/O terminals. By
following this procedure, the surface contamination caused by the dispersion of flux while
soldering can be avoided.
(2) Removing the wiring
(When a lead wire, or a connector to the I/O terminal of the module is to be removed, remove
it only after the solder at the connection has sufficiently melted since the I/O terminal is a
through hole.) If it is forcefully removed, it could cause the terminal to break or peel. The
recommended procedure is to use a suction-type solder remover. Caution: do not reheat the
I/O terminal more than 3 times.
3.4 Long-term storage
If the correct method of storage is not followed, deterioration of the display material (polarizer) and
oxidation of the I/O terminal plating may make the process of soldering difficult. Please comply with
the following procedure.
A. Store in the shipping container.
B. If the shipping container is not available, place in anti-static bags and seal the opening.
C. Store the modules where they are not subjected to direct sunlight or a fluorescent lamp.
D.Store in a temperature range of 0
35 with low relative humidity.
GENDA TECHNOLOGY LTD
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