GBU8K Datasheet PDF - Fairchild Semiconductor

No Preview Available ! October 2013 GBU8A - GBU8M Bridge Rectifiers Features • Glass-Passivated Junction • Surge Overload Rating: 200 A Peak • Reliable Low-Cost Construction Utilizing Molded Plastic Technique • Ideal for Printed Circuit Board • UL Certified: UL #E258596 Ordering Informations Part Number GBU8A GBU8B GBU8D GBU8G GBU8J GBU8K GBU8M Marking GBU8A GBU8B GBU8D GBU8G GBU8J GBU8K GBU8M Package GBU 4L GBU 4L GBU 4L GBU 4L GBU 4L GBU 4L GBU 4L +~~ - GBU Packing Method Rail Rail Rail Rail Rail Rail Rail Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. Symbol Parameter Value Units 8A 8B 8D 8G 8J 8K 8M VRRM Maximum Repetitive Reverse Voltage 50 100 200 400 600 800 1000 VRMS Maximum RMS Bridge Input Voltage 35 70 140 280 420 560 700 VR DC Reverse Voltage (Rated VR) 50 100 200 400 600 800 1000 IF(AV) Average Rectified Forward Current TC = 100°C TA = 45°C 8.0 6.0 IFSM Non-Repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave 200 TSTG TJ Storage Temperature Range Operating Junction Temperature -55 to +150 -55 to +150 V V V A A A °C °C © 2010 Fairchild Semiconductor Corporation GBU8A - GBU8M Rev. 1.2.1 1 www.fairchildsemi.com

No Preview Available ! Thermal Characteristics Values are at TA = 25°C unless otherwise noted. Symbol Parameter PD RθJA RθJC Notes: Power Dissipation Thermal Resistance per Leg, Junction to Ambient(1) Thermal Resistance per Leg, Junction to Case(2) 1. Device mounted on PCB with 0.5 × 0.5 inch (12 × 12 mm). 2. Heat-sink mounting, 4 x 4 x 0.15 inch copper plate. Electrical Characteristics Values are at TA = 25°C unless otherwise noted. Symbol Parameter VF Forward Voltage, per Element IR Reverse Current, per Element at Rated VR I2t I2t Rating for Fusing 8.0 A TA = 25°C TA = 100°C t < 8.35 ms Value 16 18 3 Units W °C/W °C/W Value 1.0 5.0 500 166 Units V μA μA A2s © 2010 Fairchild Semiconductor Corporation GBU8A - GBU8M Rev. 1.2.1 2 www.fairchildsemi.com

No Preview Available ! Typical Performance Characteristics 8 HEAT-SINK MOUNTING, TC 4"x4"x0.15" 6 COPPER PLATE 4 2 MOUNTED ON PC BOARD, TA 0.5" (12.7mm) LEAD LENGTH 60Hz RESISTIVE OF INDUCTIVE LOAD 0 0 50 100 Ambient Temperature [ºC] 150 Figure 1. Forward Current Derating Curve 10 TC= 100ºC 1 0.1 TA = 25ºC 0.01 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage [%] Figure 3. Reverse Current vs. Reverse Voltage 400 100 TA = 25º C f = 1.0 MHz Visg = 50m Vp-p 50 100 10 1 TA = 25º C Pulse Width = 300μs 1% Duty Cycle 0.1 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 Forward Voltage, V F [V] Figure 2. Forward Voltage Characteristics 250 T =150°C j 200 8.3ms Single Half Sine-Wave 150 100 50 0 1 10 100 Number of Cycles at 60Hz Figure 4. Non-Repetitive Surge Current 10 1 5 10 50 100 Reverse Voltage, VR [V] Figure 5. Total Capacitance © 2010 Fairchild Semiconductor Corporation GBU8A - GBU8M Rev. 1.2.1 3 www.fairchildsemi.com

No Preview Available ! Physical Dimension GBU-4L R1.90 TYP 22.30 21.80 3.20 X 45° 7.90 7.40 3.91 22..5146(2X) - ~~+ 2.16 1.65 9° TYP 2.03 1.52 2.03 1.65 (2X) 3.56 3.30 9° TYP 18.80 18.30 2.16 1.79 18.00 17.50 5.33 4.83 (3X) 1.27 1.02 (4X) 0.75 0.46 NOTES: A. THIS PACKAGE DOES NOT CONFORM TO ANY STANDARDS. B. ALL DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. E. DIMENSION AND TOLERANCE AS PER ASME Y14.5-1994. F. DRAWING FILE NAME: GBU04AREV1 Figure 6. 4-LEAD, GBU, THROUGH-HOLE, MOLDED PACKAGE (ACTIVE) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/GB/GBU04A.pdf. © 2010 Fairchild Semiconductor Corporation GBU8A - GBU8M Rev. 1.2.1 4 www.fairchildsemi.com

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