GBU8G Datasheet PDF - Fairchild Semiconductor

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GBU8G
Fairchild Semiconductor

Part Number GBU8G
Description Bridge Rectifiers
Page 5 Pages


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October 2013
GBU8A - GBU8M
Bridge Rectifiers
Features
• Glass-Passivated Junction
• Surge Overload Rating: 200 A Peak
• Reliable Low-Cost Construction Utilizing Molded
Plastic Technique
• Ideal for Printed Circuit Board
• UL Certified: UL #E258596
Ordering Informations
Part Number
GBU8A
GBU8B
GBU8D
GBU8G
GBU8J
GBU8K
GBU8M
Marking
GBU8A
GBU8B
GBU8D
GBU8G
GBU8J
GBU8K
GBU8M
Package
GBU 4L
GBU 4L
GBU 4L
GBU 4L
GBU 4L
GBU 4L
GBU 4L
+~~ -
GBU
Packing Method
Rail
Rail
Rail
Rail
Rail
Rail
Rail
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Units
8A 8B 8D 8G 8J 8K 8M
VRRM Maximum Repetitive Reverse Voltage
50 100 200 400 600 800 1000
VRMS Maximum RMS Bridge Input Voltage
35 70 140 280 420 560 700
VR DC Reverse Voltage (Rated VR)
50 100 200 400 600 800 1000
IF(AV)
Average Rectified Forward Current TC = 100°C
TA = 45°C
8.0
6.0
IFSM
Non-Repetitive Peak Forward Surge Current
8.3 ms Single Half-Sine-Wave
200
TSTG
TJ
Storage Temperature Range
Operating Junction Temperature
-55 to +150
-55 to +150
V
V
V
A
A
A
°C
°C
© 2010 Fairchild Semiconductor Corporation
GBU8A - GBU8M Rev. 1.2.1
1
www.fairchildsemi.com



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Thermal Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
PD
RθJA
RθJC
Notes:
Power Dissipation
Thermal Resistance per Leg, Junction to Ambient(1)
Thermal Resistance per Leg, Junction to Case(2)
1. Device mounted on PCB with 0.5 × 0.5 inch (12 × 12 mm).
2. Heat-sink mounting, 4 x 4 x 0.15 inch copper plate.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
VF Forward Voltage, per Element
IR Reverse Current, per Element at Rated VR
I2t I2t Rating for Fusing
8.0 A
TA = 25°C
TA = 100°C
t < 8.35 ms
Value
16
18
3
Units
W
°C/W
°C/W
Value
1.0
5.0
500
166
Units
V
μA
μA
A2s
© 2010 Fairchild Semiconductor Corporation
GBU8A - GBU8M Rev. 1.2.1
2
www.fairchildsemi.com



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Typical Performance Characteristics
8
HEAT-SINK
MOUNTING, TC
4"x4"x0.15"
6 COPPER PLATE
4
2 MOUNTED ON PC BOARD,
TA 0.5" (12.7mm) LEAD LENGTH
60Hz RESISTIVE OF INDUCTIVE LOAD
0
0 50 100
Ambient Temperature [ºC]
150
Figure 1. Forward Current Derating Curve
10
TC= 100ºC
1
0.1
TA = 25ºC
0.01
0
20 40 60 80 100 120 140
Percent of Rated Peak Reverse Voltage [%]
Figure 3. Reverse Current vs. Reverse Voltage
400
100
TA = 25º C
f = 1.0 MHz
Visg = 50m Vp-p
50
100
10
1
TA = 25º C
Pulse Width = 300μs
1% Duty Cycle
0.1
0.7 0.8 0.9 1 1.1 1.2 1.3 1.4
Forward Voltage, V F [V]
Figure 2. Forward Voltage Characteristics
250
T =150°C
j
200 8.3ms Single Half Sine-Wave
150
100
50
0
1 10 100
Number of Cycles at 60Hz
Figure 4. Non-Repetitive Surge Current
10
1
5 10
50 100
Reverse Voltage, VR [V]
Figure 5. Total Capacitance
© 2010 Fairchild Semiconductor Corporation
GBU8A - GBU8M Rev. 1.2.1
3
www.fairchildsemi.com



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Physical Dimension
GBU-4L
R1.90 TYP
22.30
21.80
3.20 X 45°
7.90
7.40
3.91
22..5146(2X)
- ~~+
2.16
1.65 9° TYP
2.03
1.52
2.03
1.65
(2X)
3.56
3.30
9° TYP
18.80
18.30
2.16
1.79
18.00
17.50
5.33
4.83
(3X)
1.27
1.02
(4X)
0.75
0.46
NOTES:
A. THIS PACKAGE DOES NOT CONFORM TO
ANY STANDARDS.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
E. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-1994.
F. DRAWING FILE NAME: GBU04AREV1
Figure 6. 4-LEAD, GBU, THROUGH-HOLE, MOLDED PACKAGE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/GB/GBU04A.pdf.
© 2010 Fairchild Semiconductor Corporation
GBU8A - GBU8M Rev. 1.2.1
4
www.fairchildsemi.com



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