E1SBA20-10.000M Datasheet PDF - Ecliptek Corporation

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E1SBA20-10.000M
Ecliptek Corporation

Part Number E1SBA20-10.000M
Description CRYSTAL
Page 4 Pages


E1SBA20-10.000M datasheet pdf
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E1SBA20-10.000M
PbRoHS
E1S B A 20 -10.000M
Series
RoHS Compliant (Pb-free) Resistance Welded Short
HC-49/UP SMD Crystal
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over -20°C to +70°C
Mode of Operation
AT-Cut Fundamental
Nominal Frequency
10.000MHz
Load Capacitance
20pF
ELECTRICAL SPECIFICATIONS
Nominal Frequency
10.000MHz
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over -20°C to +70°C
Aging at 25°C
±5ppm/year Maximum
Load Capacitance
20pF
Shunt Capacitance (C0)
7pF Maximum
Equivalent Series Resistance
70 Ohms Maximum
Mode of Operation
AT-Cut Fundamental
Drive Level
1mWatt Maximum
Storage Temperature Range
-40°C to +125°C
Insulation Resistance
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
Gross Leak Test
MIL-STD-883, Method 1014 Condition C
Lead Termination
Sn 2µm - 6µm
Mechanical Shock
MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20
MAX
13.30 MAX
4.88 ±0.20
4.85
MAX
0.50 MIN (x2)
11.60 MAX
0.80 ±0.30 (x2)
NOTE: Coplanarity 0.360 MAX
LINE MARKING
1 E10.000M
E=Ecliptek Designator
M=MHz
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 1 of 4



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E1SBA20-10.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
5.5 (X2)
2.0 (X2)
4.0 Solder Land
(X2)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 2 of 4



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E1SBA20-10.000M
Recommended Solder Reflow Methods
TP
TL
TS Max
TS Min
Ramp-up
Critical Zone
TL to T P
Ramp-down
t SPreheat
t 25°C to Peak
Time (t)
tL
tP
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
Time 25°C to Peak Temperature (t)
8 minutes Maximum
Moisture Sensitivity Level
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 3 of 4



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E1SBA20-10.000M
Recommended Solder Reflow Methods
TP
TL
TS Max
TS Min
Ramp-up
Critical Zone
TL to T P
Ramp-down
t SPreheat
t 25°C to Peak
Time (t)
tL
tP
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 4 of 4



E1SBA20-10.000M datasheet pdf
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Ecliptek Corporation
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