CXG1195XR Datasheet PDF - Sony Corporation

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CXG1195XR
Sony Corporation

Part Number CXG1195XR
Description High Power SP5T Antenna Switch MMIC
Page 7 Pages


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High Power SP5T Antenna Switch MMIC for GSM/UMTS Dual Mode
CXG1195XR
Description
The CXG1195XR is a SP5T antenna switch for GSM/UMTS applications. The low insertion loss on transmit
means increased talk time as the Tx power amplifier can be operated at a lower output level. On chip logic
reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital base
band control lines with the CMOS logic levels. It requires 3 CMOS control lines. The Sony GaAs JPHEMT
MMIC process is used for low insertion loss.
(Applications: GSM/UMTS dual mode handsets)
Features
‹ Insertion loss (Tx) : 0.40dB (Typ.) at 34dBm (GSM900)
0.50dB (Typ.) at 32dBm (GSM1800)
0.50dB (Typ.) at 29dBm (UMTS2100)
Package
Small and low height package size: 20-pin XQFN (2.7mm × 2.7mm × 0.35mm (Typ.))
Structure
GaAs JPHEMT MMIC
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This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E05X14A66



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CXG1195XR
Absolute Maximum Ratings
(Ta = 25°C)
Š Bias voltage
Š Control voltage
Š Input power max. [Tx1]
Š Input power max. [Tx2]
Š Input power max. [TRx]
Š Input power max. [all_Rx]
Š Operating temparature
Š Storage temperature
Š Maximum power dissipation
VDD
Vctl
Topr
Tstg
PD
7
5
35
33
32
13
–35 to +85
–65 to +150
750
V
V
dBm
dBm
dBm
dBm
°C
°C
mW
(Duty cycle = 12.5 to 50%)
(Duty cycle = 12.5 to 50%)
Copper-clad lamination of glass board (4 layers) : 30mm square, t = 0.8mm, FR-4.
Note) Use this product without exceeding the PD value specified in this specification.
If it is used with exceeding the PD value even for a moment, the heat generated by the operation may
cause the degradation or breakdown of the product.
Block Diagram
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ANT
F1
F6
F2
F7
F3
F8
F4 F9
Tx1 (GSM850/900)
Tx2 (GSM1800/1900)
Rx1
Rx2
F5
TRx (UMTS)
F10
-2-



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Pin Configuration
10 9 8 7 6
GND 11
TRx 12
GND 13
GND 14
ANT 15
16 17 18 19 20
5 Rx1
4 GND
3 Rx2
2 GND
1 GND
CXG1195XR
Truth Table
State
1
2
3
4
5
ON Path CTLA CTLB CTLC F1 F2 F3 F4 F5 F6 F7 F8 F9 F10
ANT – Tx1 H H L ON OFF OFF OFF OFF OFF ON ON ON ON
ANT – Tx2 H L L OFF ON OFF OFF OFF ON OFF ON ON ON
ANT – Rx1 L L/H L OFF OFF ON OFF OFF ON ON OFF ON ON
ANT – Rx2 L L/H H OFF OFF OFF ON OFF ON ON ON OFF ON
ANT – TRx H L H OFF OFF OFF OFF ON ON ON ON ON OFF
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-3-



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CXG1195XR
Electrical Characteristics
(Ta = 25°C)
Item
Insertion loss
Symbol
IL
Port
Tx1 – ANT
*1
Tx2 – ANT
*2
TRx (Tx) – ANT *3
ANT – Rx1
*4
ANT – Rx2
*5
ANT – TRx (Rx) *6
Active path: Tx1
ANT – Rx1
ANT – Rx2
*1
Condition
Isolation
ISO.
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VSWR
VSWR
2fo
3fo
Harmonics
2fo
3fo
2fo
3fo
Control current Ictl
Supply current IDD
Switching speed Swt
ANT – Tx2
1760 to 1830MHz
ANT – TRx
*1
Active path: Tx2
ANT – Rx1
ANT – Rx2
*2
ANT – TRx
Active path: TRx
ANT – Rx1
ANT – Rx2
*3
Tx1 – ANT
*1
Tx2 – ANT
*2
Active path: Rx1
Tx1 – ANT
*1
Tx2 – ANT
*2
Active path: Rx2
Tx1 – ANT
*1
Tx2 – ANT
*2
Tx1 – ANT
Tx2 – ANT
TRx – ANT
*1
*2
*3
Vctl = 2.8V
VDD = 2.8V
Min.
25
25
25
25
25
25
25
25
25
25
25
25
20
20
20
20
Typ.
0.35
0.45
0.45
0.5
0.65
0.5
1.2
–45
–35
–38
–33
–40
–35
20
0.2
5
Max.
0.50
0.60
0.60
0.65
0.80
0.65
Unit
dB
dB
dB
dB
dB
dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
— dB
–35 dBm
–30 dBm
–33 dBm
–30 dBm
–35 dBm
–30 dBm
50 μA
0.5 mA
10 μs
-4-



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CXG1195XR High Power SP5T Antenna Switch MMIC CXG1195XR
Sony Corporation
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