ASM3P2854C Datasheet PDF - ON Semiconductor

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ASM3P2854C
ON Semiconductor

Part Number ASM3P2854C
Description Custom Clock Generator
Page 8 Pages


ASM3P2854C datasheet pdf
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ASM3P2854C
Custom Clock Generator for
Fax System
Features
Generates Custom Clocks for FAX system from an
inexpensive 24MHz Crystal
2x 66.66MHz low EMI (Spread Spectrum) clocks for
ASIC1 (System / DDR SDRAM)
1 x 48MHz for USB1.1 HOST
2 x 33.33MHz low EMI (Spread Spectrum) clocks for
System / DDR SDRAM of ASIC2 and ASIC3
1x 25MHz low EMI (Spread Spectrum) clock for
LCD, Serial port, and buzzer of ASIC1
1x 12MHz for USB PHY (USB2.0)
1x Programmable clock for printer engine control
One of the four programmable clock outputs
selection through two Select Pins
Supply Voltage 3.3V ± 0.3V
Available in 16L TSSOP, Green package
Product Description
ASM3P2854C is a part of the two chip custom clock
generator solution for NEC FAX system. Together with
ASM3P2855D, ASM3P2854C realizes all the seventeen
clocks required by the various components and
subsystems of the FAX system. It uses an inexpensive
24MHz crystal as the input to generate two 66.66MHz low
EMI (spread spectrum) clocks used by ASIC1 for system/
DDR SDRAM, two 33.33MHz low EMI (spread spectrum)
clocks used by ASIC2 and ASIC3 for system/ DDR
SDRAM, a 25MHz low EMI (Spread Spectrum) clock
used by ASIC1 for LCD, Serial port, and buzzer, a 48MHz
clock used by USB1.1 HOST, and a 12MHz clock used
by USB PHY (USB2.0). One of the four Programmable
clock (PCLK) frequencies of 24.00448MHz,
21.33732MHz, 21.19962MHz and 20.40464MHz used for
Printer Engine control selectable through two Select pins
S1 and S2. The accuracy of the synthesized
programmable clocks is within ±18ppm. The custom clock
generator works is with a Supply Voltage for 3.3V. The
device is available in a 16L TSSOP Green package, over
0°C to +70°C temperature range. The output Clocks h ave
an accuracy of ±50ppm.
Block Diagram
XIN / CLKIN
XOUT
Crystal
(24 MHz)
VDD
PLL
PLL
PLL
S1
S2
VDD_FOUT
2 66.6MHz SSCLK
2 33.3MHz SSCLK
25MHz SSCLK
48MHz
12MHz
PCLK
©2010 SCILLC. All rights reserved.
MARCH 2010 – Rev. 1
GND
GND_FOUT
Publication Order Number:
ASM3P2854/D



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Pin Diagram
ASM3P2854Cwww.DataSheet4U.com
XIN / CLKIN 1
XOUT 2
VDD 3
VDD_FOUT 4
GND_FOUT 5
GND 6
48MHz 7
12MHz 8
16 25MHz SSCLK
15 PCLK
14 S2
13 66.6MHz SSCLK
ASM3P2854C
12 66.6MHz SSCLK
11 S1
10 33.3MHz SSCLK
9 33.3MHz SSCLK
Pin Description
Pin# Pin Name Type
Description
1 XIN / CLKIN I Crystal connection or external reference clock input.
2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected.
3 VDD P Power supply for the core
4 VDD_FOUT P Power supply for the output buffers.
5 GND_FOUT P Ground connection for the output buffers
6 GND
P Ground connection
7 48MHz O 48MHz Clock Output
8 12MHz O 12MHz Clock Output
9 33.3MHz O 33.3 MHz low EMI Clock Output
10 33.3MHz
11 S1
12 66.6MHz
O 33.3 MHz low EMI Clock Output
I
Selection Bit for Programmable Clock. To be Pulled HIGH or LOW suitably.
See the PCLK Selection Table for details
O 66.6 MHz low EMI Clock Output
13 66.6MHz
14 S2
15 PCLK
O 66.6 MHz low EMI Clock Output
I
Selection Bit for Programmable Clock. To be Pulled HIGH or LOW suitably.
See the PCLK Selection Table for details
O Programmable Clock Output
16 25MHz
O 25 MHz low EMI Clock Output
Rev. 1 | Page 2 of 8 | www.onsemi.com



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PCLK Selection Table
S2 S1
00
01
10
11
Programmable Clock (MHz)
24.00448
21.33732
21.19962
20.40464
ASM3P2854Cwww.DataSheet4U.com
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VDD,
VDD_FOUT
Voltage on any pin with respect to Ground
-0.5 to +4.6
V
TSTG
Ts
TJ
TDV
Storage temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage (As per JEDEC STD22- A114-B)
-65 to +125
260
150
2
°C
°C
°C
KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
Units
TA
Operating Temperature
0
+70 °C
VDD
Core Voltage
+3.0
+3.3
+3.6
V
VDD_FOUT
Output Buffer Voltage
+3.0
+3.3
+3.6
V
Rev. 1 | Page 3 of 8 | www.onsemi.com



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ASM3P2854Cwww.DataSheet4U.com
DC Electrical Characteristics
Symbol
Parameter
VIL Input low voltage
VIH Input high voltage
IIL Input low current
IIH Input high current
IXOL XOUT output low current (VXOL@ 0.4V, VDD = 3.3V)
IXOH XOUT output high current (VXOH@ 2.5V, VDD = 3.3V)
VOL Output low voltage (VDD = 3.3V, IOL = 10mA)
VOH Output high voltage (VDD = 3.3V, IOH = -10mA)
IDD Static supply current1
ICC Dynamic supply current ( VDD=3.3V, No Load)
VDD
Operating Core Voltage
VDD_FOUT
tON
Operating Output Buffer Voltage
Power-up time (first locked cycle after power-up)2
ZO Output impedance
Min
GND-0.3
2.0
2.5
3.0
3.0
Notes: 1. XIN / CLKIN pin is pulled to GND.
2. VDD and CLKIN inputs are stable.
Typ
3
3
33
3.3
3.3
30
Max
0.8
VDD+0.3
-35
35
0.4
15
3.6
3.6
5
Unit
V
V
µA
µA
mA
mA
V
V
mA
mA
V
V
mS
Rev. 1 | Page 4 of 8 | www.onsemi.com



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